Vapor chamber is a metal (usually copper) plate with a vacuum cavity filled with efficient coolant. This sealed chamber will absorb heat from any spot of the surface and quickly spread the heat in a two-dimensional way. When the vapor chamber touches the heat source, the coolant of that spot shall immediately vaporizes and flow to the entire cavity due to pressure difference. The vapor will condense into coolant when it flows to the cool area, releasing heat at the same time. The capillary will force the coolant back to the heat spot. And the vaporization and condensation recirculation system repeats.

Simply put, 3D V.C.V.P. means 3 Dimensional Vapor Chamber to Vapor Pipe. Other than normal heatpipe technology, V.C.V.P. technology allows the heatpipe directly soldered to the vapor chamber base. The hollow cavity of the heatpipe is connected to that of vapor chamber. The innovative idea is to enable a truly non-obstacle channel for heat transfer. After heat being drawn from the processor, it shall be absorbed by vapor chamber. Inside the vapor chamber (as an evaporator), the heat vaporizes the coolant into vapor, then, the vapor goes through to the vapor pipes. With heat transferred to heatsink fins and blown away by the fan, the vapor condenses into coolant. The capillary forces the coolant back to the vapor chamber thereafter. The vaporization and condensation recirculation system continues as the processor surface is hotter than the vapor chamber.